The SPD6524Q is a Geiger-mode InGaAs avalanche photodiode (APD) module with Dual-Channel. Operating wavelength 0.95μm ~ 1.65μm; Specifically designed for single-photon detection applications; Internally integrated with a three-stage cooler; Butterfly hermetically sealed dual-channel module with pigtail.
Name | Model | Description | Price |
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● Operating wavelength: 0.95μm ~ 1.65μm;
● Specifically designed for single-photon detection applications;
● Internally integrated with a three-stage cooler;
● Butterfly hermetically sealed dual-channel module with pigtail.
Main Optoelectronic Indicators
1. Linear mode parameters
Parameters | Test conditions(unless otherwise specified,TC =25±5℃) | Min | Max | Unit |
Effective detection surface diameter | — | 25 | — | μm |
Spectral response range | — | 950 | 1650 | nm |
Reverse breakdown voltage VBR | IR=10 μA ,Φe=0 | 60 | 85 | V |
Responsivity Re | Φe=1μW,VR=(VBR-1)V, λ=1550 nm±50 nm | 8 | A/W | |
Dark current ID | VDC =(VBR-1) V,Φe=0 | 1 | nA | |
Capacitance Ctot | VDC =(VBR-1) V,f=1MHz | — | 0.2 | pF |
Breakdown voltage temperature coefficient η | TC =-45~+30℃ , IR =10μA,φe=0 | 0.10 | 0.2 | V/℃ |
2. Geiger Mode Parameters
Parameters | Test Conditions | Min | Max | Unit |
Single photon detection efficiency PDE | TA = -30±5℃, μ=1, fg = 100 MHz, fP = 500 kHz, DCR ≤ 5.0 kHz ,λ = 1.55μm | 10 | % | |
Dark count rate DCR | TA = -30±5℃, fg = 100 MHz, SPDE = 10%±0.5 % ,λ = 1.55μm | 2.5 | kHz | |
After pulse probability APP (1000 ns) | TA = -30±5℃, μ=1, fg = 100 MHz, fP = 500 kHz, SPDE = 10%±0.5 % ,λ = 1.55μm | 3 | % | |
Time jitter TJ | SPDE=10% | 500 | ps |
Note: λ is the incident light wavelength, Tₐ is the test temperature value, μ is the average number of photons per pulse, fg is the gating signal frequency, and fₚ is the optical pulse signal frequency.
Absolute Maximum Ratings and Recommended Operating Conditions
Item | Parameter | Rating | |
Absolute Maximum Ratings | 1 | Storage temperatureTSTG | -50℃~+85℃ |
2 | Operating environment temperatureTC | -50℃~60℃ | |
3 | Soldering temperatureTsld(time) | 260℃(10s) | |
4 | Reverse DC bias voltage VDC | VBR+5 V | |
5 | Input optical powerφe(continuous) | 1 mW | |
6 | Forward currentIF(continuous) | 200 μA | |
7 | Electrostatic discharge sensitivityESD | ≥300 V | |
8 | Pigtail pulling force | 3.0 N | |
9 | TEC voltage | 11.9 V | |
10 | TEC current | 0.8 A |
Item | Parameter | Rating | ||
Recommended Operating Conditions | 1 | APD chip operating temperatureTth | -50℃~-30℃ | |
2 | Reverse DC bias voltageVDC | VBR+1V~VBR+5V |
Typical characteristic curve
Figure 1 Photocurrent and dark current curves
Figure 2 Breakdown voltage temperature coefficient
Package Outline
Dimensions
Symbol | Min | Max | Symbol | Min | Max | Symbol | Min | Max | |||
H1 | 6.5 | - | 7.0 | L2 | 10.0 | - | 30.0 | L8 | 8.8 | - | 9.2 |
H2 | 1.8 | - | 2.2 | L3 | 3.8 | - | 4.2 | L9 | 12.5 | - | 13.5 |
H3 | 6.5 | - | 7.0 | L4 | 3.0 | - | 3.3 | L10 | 28.5 | - | 30.5 |
H4 | 9.0 | - | 10.5 | L5 | 29.2 | - | 29.8 | ф 1 | 3.0 | - | 6.6 |
L0 | 1000.0 | - | - | L6 | 24.5 | - | 25.5 | ф2 | 0.35 | - | 0.50 |
L1 | 21.2 | - | 21.8 | L7 | - | 2.54 | - | ф3 | 2.2 | - | 2.6 |
Equivalent Circuit and Pin Definitions
Pin# | Function | Pin# | Function |
1 | Reserved | 8 | Reserved |
2 | Reserved | 9 | Reserved |
3 | Diode I (N) | 10 | Diode II (N) |
4 | Diode I Signal Out (Vout) | 11 | Diode II Signal Out (Vout) |
5 | Diode I (P) | 12 | Diode II (P) |
6 | Thermistor (Rth) | 13 | Thermistor (Rth) |
7 | TEC+ | 14 | TEC- |
TEC\NTC Electrical parameters
NTC (Thermistor): RT=10 kΩ @ 25℃, β=3450,5%.
TEC (Thermoelectric Cooler): IMAX=0.8 A, VMAX=11.9 V, THMAX=200℃
SPD6524Q-XX-XX/XXX(XXX)
XX:Fiber Type
SM
XX/XXX:Fiber Connector
XX: FC
SC
LC
NC
XXX:
UPC
APC
(XXX):Fiber Length
1.0m
1.5m
Note:
● The product is an electrostatic sensitive device, and ESD protection must be taken during storage and use.
● The bending radius of the product fiber is not less than 30mm. Avoid fiber breakage and contamination or damage to the connector during storage and use.
● The product requires external refrigeration. The clamping carrier used for refrigeration needs to be made of a material with good thermal conductivity, keep the cavity wall at one end of the device lead and the contact surface of the clamping carrier tightly matched, and apply thermal conductive material on the contact surface of the two.
● The product should be stored in a clean environment with ventilation and no corrosive gas at a temperature of -10~+40℃ and a relative humidity of no more than 80%.