High power C-band DFB Laser Diode Chips     


LD-PD INC HC50100C1.5 high power distributed feedback laser (DFB) is a CW InP MQW laser diode. It shows high thermal stability, high side-mode suppression ratios (SMSR), and low relative intensity noise (RIN).



Product model


Name Model Price
High power C-band DFB Laser Diode Chips   [PDF]  [RFQ]

HC50100C1.5
(Stock NO. Not entered)
[Please inquire]


Parameter



Features

● Center wavelength at C-band

● More than 100mW Output power

● Single transverse mode

● Compliant with ROHS

E/O Characteristics

Electro-Optical Characteristics(T=25℃, unless noted otherwise)

Parameter

Symbol

Test   Conditions

Min.

Typ.

Max.

Unit

Threshold Current

Ith

CW



15

mA

Slope Efficiency

η

If=Ith+5mA to Ith+100mA

0.25

0.4


W/A

Front Power

Pf

bar-tester,   CW

50



mW

80



mW

100



mW

Forward Voltage

Vf

If≤400mA



3.0

V

Series Resistance

R

Slope   between

I1=40mA,   I2=50mA



8

Ohms

Wavelength/temperature coefficient


CW


0.098


nm/

Peak Wavelength

λp

If,   C-band


ITU-C


nm

Side Mode Suppress Ratio

SMSR

Po=Pf

35



dB

Beam Divergence Angle

(Horizontal, FWHM)

θh

If=Ith+20mA


22

30

deg

Beam Divergence Angle

(Vertical, FWHM)

θv

If=Ith+20mA


23

30

deg

RIN

RIN

If=IOP



-150

dB/Hz


Absolute maximum ratings

Parameter

Symbol

Min.

Typ.

Max.

Unit

Forward Current (LD) with TEC

If



500

mA

Reverse Voltage (LD)

Vr



2

V

Operating Case Temperature

Under TEC control package

Top

-10


60

Storage Temperature Package

Tstg

-20


65

Storage Relative Humidity

RH



85

Solder Reflow Temperature (10sec max)

Ts



300

Package Size

Outline Drawing (unit: mm)

CB.png

The maximum cavity length is 1500um. Unless otherwise specified, the standard cavity length is 1200um

Parameter

Symbol

Value

Unit

Cavity Length

L

≤1500

µm

Width

W

250±10

µm

Chip Thickness

H

110±15

µm


COC form

CB1.png

COC top view


CB2.png

COC section view

Cautions:

1.LD chips are relatively sensitive, so avoid touching the cavity surface and ridge waveguide.

2. The packaging material can use an anti-static protective layer, and degradable materials cannot be used. It must comply with ROHS and REACH environmental protection requirements. Materials that release chemicals during degradation and cause chip contamination should not be used.

3. Chip storage boxes and transport tools should be cleaned regularly. They should be stored in sealed bags and containers for long-term transportation, and the chips must always be placed in containers and taken out when needed.

4. The conditions for using the chip storage cabinet are as follows:

(1) Relative humidity in the cabinet: 7%~30%;

(2) Number of suspended particles: in accordance with GB/T 25915.1-2010;

(3) Purification gas: 99% nitrogen or dry air;

(4) Temperature: 17℃~28℃. 

5. Environmental requirements: Conditions for long-term storage of chip cabinets or containers:

(1) Purified gas: 99% nitrogen or inert gas (purity greater than 99.5%);

(2) Temperature: 17℃~25℃;

(3) Relative humidity: 7%~25% (anti-static accumulation/anti-condensation and moisture ingress);

(4) ESD level: ≥150V;

(5) Gas pressure: slightly higher than ambient atmospheric pressure

6. The chip is adhered to the blue film, and the adhesion between the chip and the blue film is moderate to ensure that: the chip does not fall off, and the chip is not too tightly adhered to be difficult to remove and thus damaged.

7. During transportation, moisture-proof packaging is added outside the standard anti-static packaging. The chip is sealed in an anti-static vacuum bag, and the vacuum bag and anti-static shock-absorbing materials are placed in the inner packaging box together, and the product certification mark is placed on the packaging box; the inner packaging box and the shock-absorbing materials are placed in the outer transport packaging box, and then the final mark of the product certification is placed on the packaging box; the carton is made of insulating material.

Application

● Silicon photonic optical source

● CW optical source in CATV

● Long haul WDM

● Sensing, RF links  



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