Extended InGaAs Photodiodes Chips, high sensitivity photo-diode for use in infrared instrumentation and sensing applications. High spectral response in the region 900 nm to 2600 nm.
| Name | Model | Description | Parameter | Price |
|---|
● High responsivity
● Cutoff wavelength: 2.5-2.6um
● Low dark current
● Top illuminated planar structure
PARAMETER | SYMBOL | ACTIVE AREA (um) | MIN | TYP | MAX | UNIT | TEST CONDITIONS |
Response range | λ | All | 1000 | 2600 | nm | ||
Responsivity | R | All | 1.0 | A/W | λ=2300nm | ||
Capacitance | C | Φ300 | 120 | pF | VR=-1V, f= 1MHz | ||
Φ500 | 160 | ||||||
Φ1000 | 300 | ||||||
Dark current | ID | Φ300 | 1.0 | 2.0 | uA | VR=-0.5V | |
Φ500 | 3.0 | 6.0 | |||||
Φ1000 | 5.0 | 10.0 | |||||
Breakdown | Vbr | All | 2 | I= 10uA |
Spectral Response

Absolute Maximum Ratings
PARAMETER | SYMBOL | VALUE | UNIT |
Reverse voltage | VRmax | 1 | V |
Forward Current | 10 | mA | |
Operating temperature | Topr | -40 to +85 | ℃ |
Storage temperature | Tstg | -40 to +100 | ℃ |
Dimension Parameter
PARAMETER | SYMBOL | Φ300 | Φ500 | Φ1000 | UNIT |
Active area diameter | - | 300 | 500 | 1000 | µm |
Bond pad diameter | - | 80 | 80 | 120 | µm |
Die size | - | 420x420 | 600x600 | 1250x1250 | µm |
Die thickness | t | 180±20 | 180±20 | 180±20 | µm |
Precautions for use
This chip is susceptible to damage as a result of ESD. Use of ground straps, antistatic mats, and other standard ESD protective equipment is requisite when handling or testing an InGaAs or GaAs PIN/APD chip.
● Gas analyzers
● Moisture meters
● Near-infrared sensing
● Optical power meters
PN#LD-PD300L-2600
Response Range: 900-2600nm, Active area diameter:300um, Bare Chip
PN#LD-PD500L-2600
Response Range: 900-2600nm, Active area diameter:500um, Bare Chip
PN#LD-PD1000L-2600
Response Range: 900-2600nm, Active area diameter:1000um, Bare Chip