Our optical transmit and detect chips build a high-speed interconnection foundation for AI computing clusters and cloud data centers. The product portfolio includes high-speed modulated light sources, narrow-linewidth continuous-wave lasers, high-speed optical receiver components and optical switching subsystems, delivering low-power, highly integrated transmission capabilities for data center interconnection networks.
Built on a stable and reliable indium phosphide (InP) manufacturing platform, these products support stable and efficient data exchange in hyperscale computing networks.
Looking ahead, our new-generation co-packaged optical engines are compatible with co-packaged optics and near-packaged optics architectures, providing high-density light source and integrated transmit-receive solutions for next-generation AI data centers. Together, this suite of optic