Features
Thin-Film LiNbO3 Technology: Enables a tighter optical mode and higher efficiency, leading to an ultra-compact footprint and lower driving voltages.
High Bandwidth: 3dB electrical response bandwidth exceeding 10GHz.
Low Insertion Loss & Low Vpi: Typical insertion loss of only 3.5 dB and a half-wave voltage within 4V.
Excellent Polarization Purity: High-purity polarization-maintaining fiber (PMF) pigtails ensure a polarization crosstalk of -25dB.
Specifications
Technical Specifications
All specifications are measured at 25deg unless otherwise noted.
Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
Electro-Optic Bandwidth | S21 | From 2GHz start frequency | 10 | 12 | — | GHz |
RF Return Loss | S11 | Up to 10GHz | — | — | -10 | dB |
Operating Wavelength | λ | Optimized center wavelength | 750 | 850 | 930 | nm |
Optical Insertion Loss | IL | 850nm CW laser, 0 dBm input | — | 3.5 | 4.0 | dB |
Fiber Polarization Crosstalk | PER | PMF Extinction Ratio | — | — | -25 | dB |
RF Half-Wave Voltage | Vpi | Low-frequency reference (f = 50kHz) | — | 3.5 | 4.0 | V |
Typical S21 Frequency Response
Absolute Maximum Ratings
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
Parameter | Symbol | Rating | Unit |
Maximum Input Optical Power | Ps,o | 100 | mW |
Maximum Input RF Power | Ps,rf | 23 | dBm |
Operating Temperature | TW | -40 to +80 | °C |
Storage Temperature | TS | -55 to +85 | °C |
Dimension
Interface & Pin Definition
Interface Name | Symbol | Connector / Fiber Type | Description |
RF Modulation Input | RFIN | 2.92 mm (K-connector) Female | 50ohm RF drive input |
Optical Input Port | OPIN | FC/APC Connector, PM Fiber | Input pigtail (Slow axis aligned) |
Optical Output Port | OPOUT | FC/APC Connector, PM Fiber | Phase-modulated output pigtail |
User Safety & Operating Guidelines
Electrostatic Protection (ESD): This device is highly sensitive to static electricity. Proper ESD grounding precautions (e.g., wrist straps, grounded mats) must be followed at all times during handling and installation to prevent irreversible catastrophic damage.
Fiber Handling: Do NOT pull, twist, or sharply bend the input/output fiber pigtails. Maintain a safe bend radius ($>30\text{ mm}$) to avoid micro-bends and fiber fractures.
Optical Cleanliness: Ensure the FC/APC fiber connectors are thoroughly cleaned using optical-grade wipes and fiber scopes before mating or connecting to a laser source.
Mounting & Torque: When securing the module to a heatsink or breadboard using the mounting holes, ensure the screw torque and alignment parameters are applied evenly to prevent internal structural stress on the chip.
Mechanical Dimensions
The mechanical footprint and package drawings follow standard mounting interfaces with a total length of $45.00\text{ mm}$ and tab hole spacing of $40.50\text{ mm}$. For detailed tolerances, please reference the engineering drawing provided in the mechanical attachment.
Application
● Optical Fiber Communications
● Microwave Photonics (MWP)
● Quantum Information & Coherent Optical Systems
