Center Wavelength 974nm, Device Kink-free 850mW, with TEC, Single Mode (SM), 10-pin mini-butterfly
| Part Number : LP8075XX105 |
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This product is a high-reliability encapsulated pump device offering multiple power options to meet diverse scenario requirements. It utilizes a hermetic packaging solution to ensure long-term stability in communication-grade environments.
Specification Index | Symbol | Unit | Min | Typical | Max | Description |
| Threshold Current | Ith | mA | 80 | 120 | ||
20dB Bandwidth | Δλ | nm | 2 | |||
FBG Temp. Drift Coefficient | Δλp/ΔT | nm/°C | 0.02 | |||
Power Stability | ΔPf_t | 10% | Output power 10mW ~ 20mW, sampling freq.50kHz, duration 1min | |||
5% | Output power 20mW ~ Pop, BOL, sampling freq. 50kHz, duration 1min | |||||
Center Wavelength Stability at Fixed Temp. | Δλp | nm | 0.5 | Output power 10mW ~Pop,BOL,Δλp =Max(λp) -Min(λp),in an hour | ||
Center Wavelength | λC | nm | 973 | 975.3 | ||
Back-facet PD Responsivity | RMPD | μA/mW | 0.1 | 5 | Output power:10mW- Pop,BOL, Vr, PD = 5V | |
Back-facet PD Dark Current | Id | nA | 300 | Vr, PD = 5V | ||
Thermistor Resistance | Rth | Kohm | 9.5 | 10 | 10.5 | Ts= 40°C |
Thermistor B-value | Bth | K | 3500 | 3930 | 4200 | |
TEC Operating Heating Current | ITEC_Heat | A | -1.2 | Tc = -5℃ | ||
TEC Operating Heating Voltage | VTEC_Heat | V | -2 | Tc = -5℃ |
Maximum Ratings
Specification Index | Symbol | Unit | Minimum | Maximum | Description |
LD Forward Current | If | A | 1.1 * EOL | CW (Continuous Wave) | |
LD Reverse Voltage | Vr | V | 2 | ||
LD Reverse Current | Ir | uA | 10 | ||
LD ESD Damage | VESD, LD | V | 500 | C = 100pF,R =1.5kΩ,HBM Model | |
PD Reverse Voltage | Vr, PD | V | 20 | ||
PD Forward Current | If, PD | mA | 10 | ||
PD ESD Damage | VESD, PD | V | 200 | C = 100pF, R = 1.5kohm, HBM Model | |
TEC Current | ITEC, AMR | A | -1.6 | 2.4 | |
TEC Voltage | VTEC, AMR | V | -2.6 | 4 | |
Operating Ambient Temp. | Tc | °C | -5 | 75 | Long-term operating temp -5 ~ +65°C; 65 ~ 75°C continuous operation < 96h; cumulative < 15 days per year |
Storage Temperature | Tstg | °C | -40 | 85 | 2000h Max |
LD Operating Temp. | Ts | °C | 25 | 55 | Duration < 1min |
Operating Relative Humidity | RHop | % | 5 | 95 | Water in every 1.0kg of dry air must not exceed... (cut off in image) |
Storage Relative Humidity | RHstg | % | 5 | 95 |
Specification Index | Symbol | Unit | Minimum | Maximum | Description |
Weight | kg | 0.024kg | |||
Lead Soldering Temperature | Tsoldering | °C | 400 | Duration less than 10s, $c≤75°C | |
Pigtail Axial Pull | N | 5 | 3 * 10s | ||
Pigtail Lateral Pull | N | 2.5 | 3 * 10s | ||
Fiber Bending Radius | mm | 13 |
Absolute Maximum Ratings refer to the highest rated values that the device can withstand for a short period of time. Operating the device beyond these maximum ratings may cause permanent damage. Long-term exposure to any absolute maximum rating conditions may affect the reliability and service life of the device.
Unless otherwise specified, the device operating conditions are: Case Temperature -5°C ~ +75°C, FBG Temperature -5°C ~ +75°C, LD Operating Temperature 40°C, and PD Bias Voltage -5V.
Operating Parameters for Different Power Levels
Power Level | Kink-Free Min Power Pkink (mW) | Max Operating Current under EOL Conditions Iop,EOL, Kink-Free Max Current Ikink (mA) | Max Output Optical Power under BOL Conditions Pop,BOL (mW) | Max Operating Current under BOL Conditions Iop,BOL (mA) | Max Operating Voltage under EOL Conditions Vop,EOL (V) | Max TEC Operating Current under EOL Conditions ITEC,EOL (A) | Max TEC Operating Voltage under EOL Conditions VTEC,EOL (V) | Total Device Power Consumption under EOL Conditions Pcon,EOL (W) |
1000 | 1000 | 1804 | 909 | 1640 | 2.3 | 2 | 3.3 | 7.2 |
930 | 930 | 1705 | 845 | 1550 | 2.3 | 2 | 3.3 | 6.6 |
850 | 850 | 1606 | 773 | 1460 | 2.25 | 1.85 | 3.1 | 6 |
750 | 750 | 1458 | 682 | 1325 | 2.25 | 1.85 | 3.1 | 5.6 |
660 | 660 | 1293 | 600 | 1175 | 2.25 | 1.7 | 2.9 | 5.3 |
600 | 600 | 1175 | 545 | 1068 | 2.2 | 1.7 | 2.9 | 4.5 |