1550nm 10 GHz EO Phase Modulator     


The PM-1550-10G-P-P-FA-FA(TF) is a high-performance electro-optic phase modulator based on advanced Thin-Film Lithium Niobate (TFLN) chip packaging technology. Featuring a 3dB electro-optic bandwidth 10GHz, a low half-wave voltage less than 5V, and a polarization extinction ratio less than -25dB, this compact device is ideally suited for demanding deployment in cutting-edge industries.



Product model


Name Model Price
1550nm 10 GHz EO Phase Modulator   [PDF]  [RFQ]

PM-1550-10G-P-P-FA-FA(TF)
[Please inquire]

Parameter


Features

● Ultra-Compact Footprint 

● 10 GHz Operational Bandwidth 

● Low Insertion Loss 

● High Polarization Extinction Ratio (Low Cross-Talk) 

● Industrial-Grade Reliability 

E/O Characteristics

All specifications are measured at 25deg unless otherwise specified

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

Electro-Optic Bandwidth

S21

Starting from 2 GHz

10

12

GHz

RF Return Loss

S11

-10

dB

Operating Wavelength

λ

1550

nm

Insertion Loss

IL

1550 nm CW, 0 dBm

3.5

4

dB

Polarization Extinction Ratio

PER

-25

dB

RF Half-Wave Voltage

1550 nm CW, f = 50kHz

4.5

5

V


PJ1.png

Typical S21 Frequency Response

Maximum Absolute Ratings

Parameter

Symbol

Absolute   Maximum Rating

Unit

Input Optical Power

Pso

100

mW

Input RF Power

Ps,rf

23

dBm

Operating Temperature

TW

-40 to +80

°C

Storage Temperature

TS

-55 to +85

°C

Dimensions and Pin definitions

Package Dimensions

PJ2.png

Port and Pin Definitions

Port / Interface

Symbol

Description   / Connector Type

RF Input

RFIN

2.92mm female connector (K-connector)

Optical Input

OPIN

PM Fiber (Polarization Maintaining) with FC/APC connector

Optical Output

OPOUT

PM Fiber (Polarization Maintaining) with FC/APC connector


Handling Precautions & Usage Guidelines

ESD Protection: Proper Electrostatic Discharge (ESD) protective measures (e.g., grounded wrist straps, ESD-safe workstations) must be strictly followed to prevent catastrophic static damage to the internal TFLN chip. 

Fiber Handling: Do not pull, sharply bend, or apply excessive tensile force to the fiber pigtails. Ensure that the optical FC/APC ferrule end-faces are thoroughly inspected and cleaned with optical-grade wipes before connection. 

Assembly / Bonding: For internal board integration, parameters such as die-bonding force, micro-welding pressure, and soldering temperature profiles must be carefully calibrated to avoid physical damage or thermal shock to the chip. 


Application

● Optical Fiber Communications 

● Microwave Photonics (MWP) 

● Quantum Information & Coherent Optical Systems

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