The PM-1550-10G-P-P-FA-FA(TF) is a high-performance electro-optic phase modulator based on advanced Thin-Film Lithium Niobate (TFLN) chip packaging technology. Featuring a 3dB electro-optic bandwidth 10GHz, a low half-wave voltage less than 5V, and a polarization extinction ratio less than -25dB, this compact device is ideally suited for demanding deployment in cutting-edge industries.
| Name | Model | Description | Parameter | Price |
|---|
● Ultra-Compact Footprint
● 10 GHz Operational Bandwidth
● Low Insertion Loss
● High Polarization Extinction Ratio (Low Cross-Talk)
● Industrial-Grade Reliability
All specifications are measured at 25deg unless otherwise specified
Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
Electro-Optic Bandwidth | S21 | Starting from 2 GHz | 10 | 12 | — | GHz |
RF Return Loss | S11 | — | — | — | -10 | dB |
Operating Wavelength | λ | — | — | 1550 | — | nm |
Insertion Loss | IL | 1550 nm CW, 0 dBm | — | 3.5 | 4 | dB |
Polarization Extinction Ratio | PER | — | — | — | -25 | dB |
RF Half-Wave Voltage | VΠ | 1550 nm CW, f = 50kHz | — | 4.5 | 5 | V |

Typical S21 Frequency Response
Maximum Absolute Ratings
Parameter | Symbol | Absolute Maximum Rating | Unit |
Input Optical Power | Pso | 100 | mW |
Input RF Power | Ps,rf | 23 | dBm |
Operating Temperature | TW | -40 to +80 | °C |
Storage Temperature | TS | -55 to +85 | °C |
Package Dimensions

Port and Pin Definitions
Port / Interface | Symbol | Description / Connector Type |
RF Input | RFIN | 2.92mm female connector (K-connector) |
Optical Input | OPIN | PM Fiber (Polarization Maintaining) with FC/APC connector |
Optical Output | OPOUT | PM Fiber (Polarization Maintaining) with FC/APC connector |
Handling Precautions & Usage Guidelines
ESD Protection: Proper Electrostatic Discharge (ESD) protective measures (e.g., grounded wrist straps, ESD-safe workstations) must be strictly followed to prevent catastrophic static damage to the internal TFLN chip.
Fiber Handling: Do not pull, sharply bend, or apply excessive tensile force to the fiber pigtails. Ensure that the optical FC/APC ferrule end-faces are thoroughly inspected and cleaned with optical-grade wipes before connection.
Assembly / Bonding: For internal board integration, parameters such as die-bonding force, micro-welding pressure, and soldering temperature profiles must be carefully calibrated to avoid physical damage or thermal shock to the chip.
● Optical Fiber Communications
● Microwave Photonics (MWP)
● Quantum Information & Coherent Optical Systems